English
Shenzhen REUNION Electronic Co., Ltd. has supplied power interconnect solutions since 2011 for medical devices, robotics, semiconductor equipment, and industrial automation. These Power Connectors are built to carry current with low voltage drop and stable contact temperature, ensuring reliable performance under continuous load conditions.
Current capacity depends on contact geometry, base metal, and surface plating. Copper alloy contacts with gold or silver plating are selected to minimize oxidation and maintain consistent resistance over repeated mating. REUNION evaluates each design for thermal rise at the contact interface, which is the critical point where overheating can occur during high-current operation.
Creepage and clearance distances are defined according to working voltage and insulation category, preventing arc-over between adjacent contacts. Housing materials offer flame retardancy and mechanical rigidity. For environments with moisture or particulate exposure, sealed variants incorporate gaskets and cable glands to achieve ingress protection. Detailed rating information is available in the Waterproof Connector category.
Some equipment requires high-current paths alongside low-level signal circuits. REUNION develops hybrid configurations that separate power pins from signal pins to limit interference, as outlined in the Power and Signal Connector section. Complete Cable Assembly services are provided in-house, covering wire preparation, termination, and overmolding so customers receive harnesses ready for direct integration.
The Shenzhen facility spans 4,000 square meters, operates 10 production lines, and employs about 150 people. Monthly output capacity is near 100,000 sets. The engineering team completes over 30 customized projects annually and is supported by 13 patents and 2 software copyrights. Quality management follows ISO 9001, ISO 14001, and ISO 13485 where applicable, with compliance testing to UL, CB, and CQC standards. Production lots are tracked through the ERP system from raw material receipt to final electrical testing.
Contact size should be matched to the required continuous current and wire gauge. For multi-contact configurations, derating may be necessary because adjacent contacts generate additional heat. REUNION can provide temperature rise data based on the actual layout and operating conditions.
Yes. Sealed versions with O-rings and cable glands can achieve IP67 or higher depending on the housing design. REUNION tests these assemblies under the specified ingress conditions to confirm performance before shipment.
Yes. Hybrid designs can include dedicated power contacts and separated signal pins within the same shell. The engineering team verifies insulation spacing and shielding requirements to ensure both circuit types operate reliably.
